标准编号 | 标准名称 |
---|---|
GBT4937-1995 | 半导体器件机械和气候试验方法 |
SJT10745-1996 | 半导体集成电路机械和气候试验方法 |
GJB128A-97 | 半导体分立器件试验方法 |
GJB360B-2009 | 电子及电气元件试验方法 |
GJB548B-2005 | 微电子器件试验方法和程序 |
JESD22-A104C | 温度循环 |
JESD22-A106B | 热冲击 |
JESD22-A107B | 盐雾 |
JESD22-A120A | Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices |
JESD22-B102E | 可焊性 |
JESD22-B105C | Lead Integrity |
JESD22-B106D | Resistance to Solder Shock for Through-Hole Mounted Devices |
JESD22-B107C | Marking Permanency |
JESD22-B108A | Coplanarity Test for Surface-Mount Semiconductor Devices |
JESD22-B109A | Flip Chip Tensile Pull |
JESD22-B111 | Board Level Drop Test Method of Components for Handheld Electronic Products |
JESD22-B112 | High Temperature Package Warpage Measurement Methodology |
JESD22-B113 | Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products |
JESD22-B114 | Mark Legibility |
JESD22-B115 | Solder Ball Pull |